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Master of Engineering in Packaging Technology
Wednesday, 13 January 2010 | by Serena | Rating
The International Institute of Packaging (IPI) announces the next Master of Engineering in Packaging Technology is starting on March 2010.
The program is focused on the area of lightweight primary packaging with the emphasis on fillgood/primary packaging interaction, food and life science applications, multilayer laminates and composite materials, process orientation and packaging management.
The program is part-time and usually lasts four semesters. The program represents 120 ETCS Credits (European Credit Transfer System) includes a study-visit to Michigan State University, USA. The program is taught and assessed in English, with the thesis normally completed in English.
For more information, visit IPI official site: www.ipi.eu
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